Ηλεκτρονικών μερών : K4H560838E-UCB3

Κατασκευαστής : SAMSUNG[Samsung semiconductor]

Συσκευασία :

Pins :

Περιγραφή : 256Mb E-die SDRAM Specification TSOP-II with Pb-Free (RoHS compliant)

Θερμοκρασία : Min °C | Max °C

Datasheet : K4H560838E-UCB3 PDF

• K4H560838E
• K4H560838E-GC/LA2
• K4H560838E-GC/LB0
• K4H560838E-GC/LB3
• K4H560838E-GCA2
• K4H560838E-GCB0
• K4H560838E-GCB3
• K4H560838E-GCC4
• K4H560838E-GCCC
• K4H560838E-GCLA2
• K4H560838E-GCLB0
• K4H560838E-GCLB3
• K4H560838E-GLA2
• K4H560838E-GLB0
• K4H560838E-GLB3