Ηλεκτρονικών μερών : K4H1G0838M-ULA2

Κατασκευαστής : SAMSUNG[Samsung semiconductor]

Συσκευασία :

Pins :

Περιγραφή : M-die SDRAM Specification TSOP-II with Pb-Free (RoHS compliant)

Θερμοκρασία : Min °C | Max °C

Datasheet : K4H1G0838M-ULA2 PDF

• K4H1G0838M-LA2
• K4H1G0838M-LB0
• K4H1G0838M-LB3
• K4H1G0838M-TC/LA2
• K4H1G0838M-TC/LB0
• K4H1G0838M-TC/LB3
• K4H1G0838M-TCA0
• K4H1G0838M-TCA2
• K4H1G0838M-TCB0
• K4H1G0838M-TCLA2
• K4H1G0838M-TCLB0
• K4H1G0838M-TCLB3
• K4H1G0838M-TLA0
• K4H1G0838M-TLA2
• K4H1G0838M-TLB0